TY - JOUR

T1 - Geometry optimization of thermoelectric coolers using simplified conjugate-gradient method

AU - Huang, Yu Xian

AU - Wang, Xiao Dong

AU - Cheng, Chin Hsiang

AU - Lin, David Ta Wei

N1 - Funding Information:
This study was supported by the National Natural Science Foundation of China (No. 51276060 ), by the 111 Project (No. B12034 ), by Program for New Century Excellent Talents in University (No. NCET-11-0635 ), and by the Fundamental Research Funds for the Central Universities (No. 11ZG01 ).

PY - 2013/9/15

Y1 - 2013/9/15

N2 - This paper develops an inverse problem approach to optimize the geometric structure of TECs (thermoelectric coolers). The approach integrates a complete multi-physics TEC model and a simplified conjugate-gradient method. The present TEC model couples the heat and electrical conductions and accounts for all physical mechanisms occurred within TECs. Three geometric parameters, the semiconductor pair number, N, leg length of semiconductor column, Hpn, and base area ratio of semiconductor columns to TEC, γ, are optimized simultaneously at fixed current and fixed temperature difference. The cooling rate on the cold end is the objective function to be maximized to obtain the optimal TEC geometry. The effects of applied current and temperature difference on the optimal geometry are discussed. The results show that at temperature difference of 20K, the geometry optimization increases the TEC cooling rate by 1.99-10.21 times compared with the initial TEC geometry, and the optimal N decreases from 100 to 47 with invariable γ=0.95 and Hpn=0.2mm, as the applied current varies from 1.0A to 3.0A. With the increase in temperature difference, the optimal N increases at smaller currents of I≤1.0A, however, it is almost invariable at larger currents of I≥1.5A.

AB - This paper develops an inverse problem approach to optimize the geometric structure of TECs (thermoelectric coolers). The approach integrates a complete multi-physics TEC model and a simplified conjugate-gradient method. The present TEC model couples the heat and electrical conductions and accounts for all physical mechanisms occurred within TECs. Three geometric parameters, the semiconductor pair number, N, leg length of semiconductor column, Hpn, and base area ratio of semiconductor columns to TEC, γ, are optimized simultaneously at fixed current and fixed temperature difference. The cooling rate on the cold end is the objective function to be maximized to obtain the optimal TEC geometry. The effects of applied current and temperature difference on the optimal geometry are discussed. The results show that at temperature difference of 20K, the geometry optimization increases the TEC cooling rate by 1.99-10.21 times compared with the initial TEC geometry, and the optimal N decreases from 100 to 47 with invariable γ=0.95 and Hpn=0.2mm, as the applied current varies from 1.0A to 3.0A. With the increase in temperature difference, the optimal N increases at smaller currents of I≤1.0A, however, it is almost invariable at larger currents of I≥1.5A.

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U2 - 10.1016/j.energy.2013.06.069

DO - 10.1016/j.energy.2013.06.069

M3 - Article

AN - SCOPUS:84883264617

VL - 59

SP - 689

EP - 697

JO - Energy

JF - Energy

SN - 0360-5442

ER -