Growth of hydrogen-free diamond-like carbon films by a particle-free hollow-cathode arc ion plating system

Chiao Yang Cheng, Franklin Chau-Nan Hong

研究成果: Conference article

12 引文 (Scopus)

摘要

A hollow cathode arc (HCA) ion plating system was developed to deposit hydrogen-free diamond-like carbon (DLC) films. Unlike the conventional cold cathodic arc, a high-temperature hollow cathodic arc was employed to generate a high flux of carbon ions and carbon ion clusters producing no micro-particles for the depositions of hydrogen-free DLC films. The plasma density characterized by a Langmuir probe was around 1011 cm- 3 near the anode. The films were characterized by Raman, α-step, SEM, nano-indentation and TEM. The deposition rate was up to 0.6 μm/h. The DLC film with hardness around 19 G Pa was obtained at a substrate bias of - 250 V. The hardness of the DLC film containing no hydrogen was relatively low, and believed to be due to the high substrate temperature (∼ 400 °C) and the high flux of Ar ion bombardments.

原文English
頁(從 - 到)206-211
頁數6
期刊Thin Solid Films
498
發行號1-2
DOIs
出版狀態Published - 2006 三月 1
事件Proceedings of the Third Asian Conference on Chemical Vapor Deposition (Third Asian-CVD), Third Asian CVD -
持續時間: 2004 十一月 122004 十一月 14

指紋

Diamond like carbon films
ion plating
hollow cathodes
Plating
Hydrogen
Cathodes
arcs
diamonds
Ions
carbon
hydrogen
Carbon
Hardness
Fluxes
Langmuir probes
Plasma density
Substrates
Nanoindentation
hardness
Ion bombardment

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

引用此文

Cheng, Chiao Yang ; Hong, Franklin Chau-Nan. / Growth of hydrogen-free diamond-like carbon films by a particle-free hollow-cathode arc ion plating system. 於: Thin Solid Films. 2006 ; 卷 498, 編號 1-2. 頁 206-211.
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Growth of hydrogen-free diamond-like carbon films by a particle-free hollow-cathode arc ion plating system. / Cheng, Chiao Yang; Hong, Franklin Chau-Nan.

於: Thin Solid Films, 卷 498, 編號 1-2, 01.03.2006, p. 206-211.

研究成果: Conference article

TY - JOUR

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AU - Cheng, Chiao Yang

AU - Hong, Franklin Chau-Nan

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N2 - A hollow cathode arc (HCA) ion plating system was developed to deposit hydrogen-free diamond-like carbon (DLC) films. Unlike the conventional cold cathodic arc, a high-temperature hollow cathodic arc was employed to generate a high flux of carbon ions and carbon ion clusters producing no micro-particles for the depositions of hydrogen-free DLC films. The plasma density characterized by a Langmuir probe was around 1011 cm- 3 near the anode. The films were characterized by Raman, α-step, SEM, nano-indentation and TEM. The deposition rate was up to 0.6 μm/h. The DLC film with hardness around 19 G Pa was obtained at a substrate bias of - 250 V. The hardness of the DLC film containing no hydrogen was relatively low, and believed to be due to the high substrate temperature (∼ 400 °C) and the high flux of Ar ion bombardments.

AB - A hollow cathode arc (HCA) ion plating system was developed to deposit hydrogen-free diamond-like carbon (DLC) films. Unlike the conventional cold cathodic arc, a high-temperature hollow cathodic arc was employed to generate a high flux of carbon ions and carbon ion clusters producing no micro-particles for the depositions of hydrogen-free DLC films. The plasma density characterized by a Langmuir probe was around 1011 cm- 3 near the anode. The films were characterized by Raman, α-step, SEM, nano-indentation and TEM. The deposition rate was up to 0.6 μm/h. The DLC film with hardness around 19 G Pa was obtained at a substrate bias of - 250 V. The hardness of the DLC film containing no hydrogen was relatively low, and believed to be due to the high substrate temperature (∼ 400 °C) and the high flux of Ar ion bombardments.

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