Heat exchanger fabrication with arrays of sensors and heaters with its micro-scale impingement cooling process analysis and measurements

C. H. Shen, Chie Gau

研究成果: Conference contribution

摘要

The design and fabrication for the thermal chip of a heat exchanger with arrays of temperature sensors and heaters for study of micro-jet impingement cooling heat transfer process is presented. This thermal chip can minimize the heat loss from the system to the ambient and provide a uniform heat flux along the wall, thus local heat transfer processes along the wall can be measured and obtained. The fabrication procedure presented can reach a chip yield of 100%, and every one of the sensors and heaters on the chip is in good operation condition. Therefore, micro-jet impingement cooling experiments can be performed to obtain both the local micro-scale heat transfer Nusselt number and flow structure along the wall. The experimental results indicate that both the micro-scale impinging jet flow structure and the heat transfer process along the wall is significantly different from the case of large-scale jet impingement cooling process.

原文English
主出版物標題TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
發行者Institute of Electrical and Electronics Engineers Inc.
頁面639-642
頁數4
ISBN(電子)0780377311, 9780780377318
DOIs
出版狀態Published - 2003 一月 1
事件12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
持續時間: 2003 六月 82003 六月 12

出版系列

名字TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
1

Other

Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
國家/地區United States
城市Boston
期間03-06-0803-06-12

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程

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