This study combined engineering practice, microencapsulated phase change material (mPCM), and aluminum honeycomb structures to construct a mPCM honeycomb panel prototype. The thermal performance of this prototype and other modules (mPCM only, mPCM+EG, and mPCM+iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and heat conductivity enhancement in the prototype rapidly transferred the heat flux into the mPCM. Thus, the latent heat can be used to achieve a lower module surface temperature than other modules. A correlation of the effective thermal protection duration of the mPCM+honeycomb modules for Ste∗=2-5 and Sc∗=0.24-0.32 was proposed.
|出版狀態||Published - 2014 一月 1|
|事件||15th International Heat Transfer Conference, IHTC 2014 - Kyoto, Japan|
持續時間: 2014 八月 10 → 2014 八月 15
|Other||15th International Heat Transfer Conference, IHTC 2014|
|期間||14-08-10 → 14-08-15|
All Science Journal Classification (ASJC) codes