Heat transfer analysis of aluminum honeycomb panels incorporating microencapsulted PCM

Chi-ming Lai, Shuichi Hokoi

研究成果: Paper同行評審

摘要

This study combined engineering practice, microencapsulated phase change material (mPCM), and aluminum honeycomb structures to construct a mPCM honeycomb panel prototype. The thermal performance of this prototype and other modules (mPCM only, mPCM+EG, and mPCM+iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and heat conductivity enhancement in the prototype rapidly transferred the heat flux into the mPCM. Thus, the latent heat can be used to achieve a lower module surface temperature than other modules. A correlation of the effective thermal protection duration of the mPCM+honeycomb modules for Ste∗=2-5 and Sc∗=0.24-0.32 was proposed.

原文English
出版狀態Published - 2014 一月 1
事件15th International Heat Transfer Conference, IHTC 2014 - Kyoto, Japan
持續時間: 2014 八月 102014 八月 15

Other

Other15th International Heat Transfer Conference, IHTC 2014
國家/地區Japan
城市Kyoto
期間14-08-1014-08-15

All Science Journal Classification (ASJC) codes

  • 機械工業
  • 凝聚態物理學

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