Heat transfer and thermal storage behaviour of gypsum boards incorporating micro-encapsulated PCM

Chi-ming Lai, R. H. Chen, Ching Yao Lin

研究成果: Article同行評審

56 引文 斯高帕斯(Scopus)

摘要

In the application of energy storage and thermal environmental control, PCM (Phase Change Material) is a very promising material choice. This study incorporated mPCM (micro-encapsulated PCM) into gypsum to make mPCM gypsum board and then investigated the physical properties, heat transfer and thermal storage behaviour. The major control parameters are wall temperatures and the weight percentages of mPCM added to the gypsum boards. A melting fraction correlation, reduced from our test data and based on Stefan number (Ste), subcooling (Sb) and Fourier number, is proposed. It shows that case with a higher Ste or Sb can have a higher heat transfer through the hot wall. Thermal storage behaviour of mPCM gypsum boards is then analyzed.

原文English
頁(從 - 到)1259-1266
頁數8
期刊Energy and Buildings
42
發行號8
DOIs
出版狀態Published - 2010 八月 1

All Science Journal Classification (ASJC) codes

  • 土木與結構工程
  • 建築與營造
  • 機械工業
  • 電氣與電子工程

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