@inproceedings{482cf26ae3194192bea9c67c726d7e88,
title = "HF-Dedupe: Hierarchical Fingerprint Scheme for High Efficiency Data Deduplication on Flash-based Storage Systems",
abstract = "Even though flash memory is widely used in many applications as storage due to its high performance, demands for lower storage cost and better I/O performance are still high because of the continuous growth of data. Data deduplication has the potential to address these issues by eliminating redundant writes in I/O workloads and different strategies have been proposed to improve its efficiency. However, existing designs mainly rely on time-consuming SHA-1 fingerprint scheme or byte-by-byte comparison to identify duplicate data, and these methods cause much overhead and become a bottleneck in data deduplication. To tackle this issue, we propose the hierarchical fingerprint scheme (HF-Dedupe) to improve the efficiency of data deduplication for flash-based storage systems. By leveraging multiple levels of light-weight hashes in the fingerprint, our design only takes the minimal effort to distinguish different data in write traffic. In order to evaluate our design, a series of experiments were conducted based on trace-driven simulations. Compared with other designs, the experimental results show that HF-Dedupe further reduces the deduplication time by 34.76%-65.02 % while retaining high deduplication ratio, and therefore achieves the most improvement to overall I/O performance.",
author = "Weng, {Kai Ting} and Hsieh, {Yun Shan} and Chen, {Yen Ting} and Liang, {Yu Pei} and Chang, {Yuan Hao} and Huang, {Po Chun} and Shih, {Wei Kuan}",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 ; Conference date: 28-10-2023 Through 02-11-2023",
year = "2023",
doi = "10.1109/ICCAD57390.2023.10323732",
language = "English",
series = "IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings",
address = "United States",
}