High aspect ratio silicon trench fabrication by inductively coupled plasma

C. K. Chung, H. C. Lu, T. H. Jaw

研究成果: Article同行評審

19 引文 斯高帕斯(Scopus)

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深入研究「High aspect ratio silicon trench fabrication by inductively coupled plasma」主題。共同形成了獨特的指紋。

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds