High density patterns fabricated in low-viscosity thermal-curable epoxy system for thermal-nanoimprint lithography

Chun Chang Wu, Steve Lien Chung Hsu

研究成果: Conference contribution

摘要

EPON828 epoxy resin crosslinked by a curing agent 954 is compatible for thermocurable nanoimprint lithography and can be used in the PET/ITO plastic substrate. The relationships between curing temperature and conversion time of the EPON828/954 epoxy resin can be obtained from DSC Isothermal Kinetics Analysis. A curing agent 954 which can cure the epoxy resin at 90°C for 10 minutes. It is suitable for low-pressure and moderate-temperature imprint process. Advantages of epoxy resist includes no solvent' good fluidity' no byproduct' low shrinkage and Strong adhesion to a broad range of substrates.

原文English
主出版物標題Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC
頁面312-313
頁數2
DOIs
出版狀態Published - 2007 十二月 1
事件s20th International Microprocesses and Nanotechnology Conference, MNC 2007 - Kyoto, Japan
持續時間: 2007 十一月 52007 十一月 8

出版系列

名字Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC

Other

Others20th International Microprocesses and Nanotechnology Conference, MNC 2007
國家Japan
城市Kyoto
期間07-11-0507-11-08

    指紋

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

引用此

Wu, C. C., & Hsu, S. L. C. (2007). High density patterns fabricated in low-viscosity thermal-curable epoxy system for thermal-nanoimprint lithography. 於 Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC (頁 312-313). [4456229] (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC). https://doi.org/10.1109/IMNC.2007.4456229