High-frequency surface acoustic wave (SAW) devices fabricated by Contact-Transferred and Mask-Embedded lithography

Chin Hsin Liu, Cheng Yu Chiu, Yung Chun Lee, Shuo Hung Chang

研究成果: Conference contribution

摘要

This paper reports the application of a newly developed lithography method, the Contact Transfer and Mask-Embedded Lithography (CMEL), in fabricating high-frequency (∼2 GHz) surface acoustic wave (SAW) filters. In sort, CMEL utilizes a thin metal film deposited on an anti-adhesion layer and a silicon mold with pre-fabricated features. The metal film bearing the mold's surface pattern can be transferred into a photo-resist layer deposited on a substrate. Subsequent etchings complete the lithography and the micro/nano-fabrication. To demonstrate CMEL and its potential, we apply CMEL for fabricating interdigital transducers of SAW filters with a line width down to 500 nm. Using a LiNbO 3 substrate, the operating frequency can reach 1.8 to 2 GHz based on this simple and easy-to-implement lithography method. Details in the CMEL, the lithography results, the high-frequency performance of the fabricated SAW devices, as well as future developments of this simple lithography method will be addressed.

原文English
主出版物標題3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
頁面402-405
頁數4
DOIs
出版狀態Published - 2008
事件3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China
持續時間: 2008 1月 62008 1月 9

出版系列

名字3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

Other

Other3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
國家/地區China
城市Sanya
期間08-01-0608-01-09

All Science Journal Classification (ASJC) codes

  • 控制與系統工程
  • 電氣與電子工程

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