High-frequency surface acoustic wave (SAW) devices fabricated by Contact-Transferred and Mask-Embedded lithography

Chin Hsin Liu, Cheng Yu Chiu, Yung-Chun Lee, Shuo Hung Chang

研究成果: Conference contribution

摘要

This paper reports the application of a newly developed lithography method, the Contact Transfer and Mask-Embedded Lithography (CMEL), in fabricating high-frequency (∼2 GHz) surface acoustic wave (SAW) filters. In sort, CMEL utilizes a thin metal film deposited on an anti-adhesion layer and a silicon mold with pre-fabricated features. The metal film bearing the mold's surface pattern can be transferred into a photo-resist layer deposited on a substrate. Subsequent etchings complete the lithography and the micro/nano-fabrication. To demonstrate CMEL and its potential, we apply CMEL for fabricating interdigital transducers of SAW filters with a line width down to 500 nm. Using a LiNbO 3 substrate, the operating frequency can reach 1.8 to 2 GHz based on this simple and easy-to-implement lithography method. Details in the CMEL, the lithography results, the high-frequency performance of the fabricated SAW devices, as well as future developments of this simple lithography method will be addressed.

原文English
主出版物標題3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
頁面402-405
頁數4
DOIs
出版狀態Published - 2008 九月 1
事件3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China
持續時間: 2008 一月 62008 一月 9

出版系列

名字3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

Other

Other3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
國家China
城市Sanya
期間08-01-0608-01-09

指紋

Acoustic surface wave devices
Lithography
Masks
Acoustic surface wave filters
Bearings (structural)
Substrates
Metals
Nanotechnology
Linewidth
Transducers
Etching
Adhesion

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

引用此文

Liu, C. H., Chiu, C. Y., Lee, Y-C., & Chang, S. H. (2008). High-frequency surface acoustic wave (SAW) devices fabricated by Contact-Transferred and Mask-Embedded lithography. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 (頁 402-405). [4484359] (3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS). https://doi.org/10.1109/NEMS.2008.4484359
Liu, Chin Hsin ; Chiu, Cheng Yu ; Lee, Yung-Chun ; Chang, Shuo Hung. / High-frequency surface acoustic wave (SAW) devices fabricated by Contact-Transferred and Mask-Embedded lithography. 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. 頁 402-405 (3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS).
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abstract = "This paper reports the application of a newly developed lithography method, the Contact Transfer and Mask-Embedded Lithography (CMEL), in fabricating high-frequency (∼2 GHz) surface acoustic wave (SAW) filters. In sort, CMEL utilizes a thin metal film deposited on an anti-adhesion layer and a silicon mold with pre-fabricated features. The metal film bearing the mold's surface pattern can be transferred into a photo-resist layer deposited on a substrate. Subsequent etchings complete the lithography and the micro/nano-fabrication. To demonstrate CMEL and its potential, we apply CMEL for fabricating interdigital transducers of SAW filters with a line width down to 500 nm. Using a LiNbO 3 substrate, the operating frequency can reach 1.8 to 2 GHz based on this simple and easy-to-implement lithography method. Details in the CMEL, the lithography results, the high-frequency performance of the fabricated SAW devices, as well as future developments of this simple lithography method will be addressed.",
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Liu, CH, Chiu, CY, Lee, Y-C & Chang, SH 2008, High-frequency surface acoustic wave (SAW) devices fabricated by Contact-Transferred and Mask-Embedded lithography. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008., 4484359, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS, 頁 402-405, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, China, 08-01-06. https://doi.org/10.1109/NEMS.2008.4484359

High-frequency surface acoustic wave (SAW) devices fabricated by Contact-Transferred and Mask-Embedded lithography. / Liu, Chin Hsin; Chiu, Cheng Yu; Lee, Yung-Chun; Chang, Shuo Hung.

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. p. 402-405 4484359 (3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS).

研究成果: Conference contribution

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Liu CH, Chiu CY, Lee Y-C, Chang SH. High-frequency surface acoustic wave (SAW) devices fabricated by Contact-Transferred and Mask-Embedded lithography. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. p. 402-405. 4484359. (3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS). https://doi.org/10.1109/NEMS.2008.4484359