High-performance inspecting system for detecting micro-crack defects of solar wafer

Shun Sheng Ke, Kun Wei Lin, Yang Cheng Lin, Jiun Ting Chen, Yung Hsing Wang, Chien Sheng Liu

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

摘要

A novel inspecting system combining a tunable exposing unit for inspecting micro-cracks of solar wafers is proposed. With the infrared ray transmitting through silicon wafers, the inspecting images will be captured by a CCD camera, and the micro-crack defects from the images will be apparently appeared. So it can easier to precisely distinguish either micro-cracks or grainboundaries from the images by certain algorithms. This inspecting system is especially effective when the thickness of the multi-crystalline silicon wafer is not constant. Furthermore, this system is also useful for controlling quality in on-line process of solar cell production.

原文English
主出版物標題IEEE Sensors 2010 Conference, SENSORS 2010
頁面494-497
頁數4
DOIs
出版狀態Published - 2010
事件9th IEEE Sensors Conference 2010, SENSORS 2010 - Waikoloa, HI, United States
持續時間: 2010 11月 12010 11月 4

出版系列

名字Proceedings of IEEE Sensors

Other

Other9th IEEE Sensors Conference 2010, SENSORS 2010
國家/地區United States
城市Waikoloa, HI
期間10-11-0110-11-04

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程

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