摘要
High-performance films (400-1600 angstrom) were formed by anodizing sputtered tantalum oxide films. The electrical properties of these two-step oxidized and sputtered/anodized films are compared with those of films prepared by anodization or sputtering only. The sputtered/anodized tantalum oxide capacitors have lower dissipation factors, higher breakdown fields, narrower breakdown distributions, and lower leakage currents. The sputtered/anodized tantalum oxide films have shown to be useful for high-charge-storage capacitor applications.
原文 | English |
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頁(從 - 到) | 722-725 |
頁數 | 4 |
期刊 | Technical Digest - International Electron Devices Meeting |
出版狀態 | Published - 1988 12月 1 |
事件 | Technical Digest - International Electron Devices Meeting 1988 - San Francisco, CA, USA 持續時間: 1988 12月 11 → 1988 12月 14 |
All Science Journal Classification (ASJC) codes
- 電子、光磁材料
- 凝聚態物理學
- 電氣與電子工程
- 材料化學