High power electronic component: Review

Ping H. Chen, Shyy W. Chang, Kuei F. Chiang, Ji Li

研究成果: Review article同行評審

32 引文 斯高帕斯(Scopus)

摘要

A large number of recent patents for cooling of high power electronic components are reviewed. Along with the progresses in the developments of material, fabrication, and packaging techniques, various single and two phase cooling devices are developed for thermal managements of electronic devices. In this respect, practical patents for heat-sink developments and implementations of nanotechnology and two-phase devices are reviewed through which the innovative concepts matching their future developing trends are disclosed.

原文English
頁(從 - 到)174-188
頁數15
期刊Recent Patents on Engineering
2
發行號3
DOIs
出版狀態Published - 2008 十二月 1

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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