How to enhance Sn-Bi low-temperature solder by alloying?

Shih Kang Lin, Chih Han Yang, Yu Chen Liu, Yuki Hirata, Hiroshi Nishikawa

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Low-temperature Pb-free solders are in demand to alleviate the warpage issue for high-density fine-pitch packaging. We designed a low-temperature tin-bismuth-silver Sn-Bi-Ag solder by CALculation of PHAse Diagram-type thermodynamic calculations using the PANDAT software and performed corresponding key experiments. The goal is to improve Sn-Bi solder's mechanical properties while keeping their low melting temperatures. The DSC measurement shows the solidus of Sn-Bi-Ag was 135.0 °C. Higher (Sn) phase fraction, low IMC fraction, and low IMC, finer (Sn) + (Bi) eutectic spacing of Sn-Bi-Ag led to the high yield strength, high ultimate tensile strength, toughness, and better elongation in as-cast after the tensile test. Furtherly, we found Ag and Sn doping in (Bi) polycrystals induced tensile stress in the (Bi) lattice and it led to the different solution effects in each (Bi) orientation. It could alleviate the anisotropic mechanical properties of (Bi) and avoid concentrated force on the weak grains.

原文English
主出版物標題2023 International Conference on Electronics Packaging, ICEP 2023
發行者Institute of Electrical and Electronics Engineers Inc.
頁面53-54
頁數2
ISBN(電子)9784991191152
DOIs
出版狀態Published - 2023
事件22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan
持續時間: 2023 4月 192023 4月 22

出版系列

名字2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference22nd International Conference on Electronics Packaging, ICEP 2023
國家/地區Japan
城市Kumamoto
期間23-04-1923-04-22

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 工業與製造工程
  • 材料力學
  • 安全、風險、可靠性和品質
  • 電子、光磁材料

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