Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects

C. L. Hsiao, C. Y. Yang, H. C. Chen, T. S. Yang, K. S. Chen, T. H. Wu, Y. C. Wang, S. Lee

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

摘要

Fan-out processes are widely used in advanced packaging technologies to accommodate broader size variations and functional combinations of dies deployed on reconstituted wafers. However, such a process generates numerous mechanical loadings during the molding and curing phases. Without careful planning, failures such as 'die shift' and 'fly die' are frequently reported, which cause serious problems for subsequent processing. Among these issues, shear stress generation during molding, which is dominated by the resulted pressure distribution and increase in the viscosity of molding compound due to curing, has been recognized as a major controlling factor for defects of die shift and fly die. Prompted by the need to predict defects beforehand, this work presents an accurate 3D model for mold flow analysis by accounting for the curing kinetics. In conjunction with finite element structural analysis, the die shift induced by mold flow is estimated, and the results compare favorably with fabrication plant observations.

原文English
主出版物標題IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
發行者IEEE Computer Society
頁面42-45
頁數4
ISBN(電子)9781538647196
DOIs
出版狀態Published - 2017 七月 1
事件12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan
持續時間: 2017 十月 252017 十月 27

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2017-October
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Other

Other12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
國家Taiwan
城市Taipei
期間17-10-2517-10-27

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

指紋 深入研究「Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects」主題。共同形成了獨特的指紋。

  • 引用此

    Hsiao, C. L., Yang, C. Y., Chen, H. C., Yang, T. S., Chen, K. S., Wu, T. H., Wang, Y. C., & Lee, S. (2017). Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects. 於 IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings (頁 42-45). (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2017-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2017.8255932