TY - JOUR
T1 - Imprint lithography for flexible transparent plastic substrates
AU - Liao, Wen Chang
AU - Hsu, Steve Lien Chung
AU - Chu, Sheng Yuan
AU - Kau, Po Ching
N1 - Funding Information:
The financial support provided by the Ministry of Economic Affairs (Taiwan, ROC) through project 91-EC-17-A-07-S1-0018 is greatly appreciated.
PY - 2004/7/1
Y1 - 2004/7/1
N2 - A novel imprinting process has been developed for the use of resist pattern transfer on flexible transparent plastic substrates. The polymer resist was first spin-coated on the mold, which was treated with a release agent. After softbaking, the resist layer was attached to a plastic substrate coated with an adhesive. The patterns were completely transferred to the substrate after removing the mold. Using this method, we were able to obtain the desired patterns on the plastic substrate without heating the substrate, which could deform the substrate.
AB - A novel imprinting process has been developed for the use of resist pattern transfer on flexible transparent plastic substrates. The polymer resist was first spin-coated on the mold, which was treated with a release agent. After softbaking, the resist layer was attached to a plastic substrate coated with an adhesive. The patterns were completely transferred to the substrate after removing the mold. Using this method, we were able to obtain the desired patterns on the plastic substrate without heating the substrate, which could deform the substrate.
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U2 - 10.1016/j.mee.2004.03.084
DO - 10.1016/j.mee.2004.03.084
M3 - Article
AN - SCOPUS:3142714665
SN - 0167-9317
VL - 75
SP - 145
EP - 148
JO - Microelectronic Engineering
JF - Microelectronic Engineering
IS - 2
ER -