Indentation characterization of fracture toughness and interfacial strength of PECVD nitrides after rapid thermal annealing

H. Y. Yan, K. S. Ou, K. S. Chen

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

This work presents the result of mechanical characterization of the fracture toughness and interfacial strength of PECVD silicon nitride films deposited on silicon subjected to rapid thermal annealing (RTA) processing between 200 and 800 °C Both micro- and nano-indentation techniques are employed to perform the experiments. In conjunction with the model proposed by Marshall and Lawn for data reduction, the fracture toughness of as-deposited nitride is obtained as 2.2 MPa√m based on a series of Vickers micro-indentation tests and this value is essentially unchanged if the RTA temperatures are below 400°C Further increase in RTA temperature would significantly enhance the fracture toughness. On the other hand, using nanoindentation testing in conjunction with the model proposed by Marshall and Evans, the interfacial strength between the nitride and silicon is determined as 17.2 J/m2 for as-deposited nitrides and it could also be significantly enhanced by RTA processes with temperatures exceeding 400°C These results should be useful to improve the structural integrity and performance of PECVD silicon nitride films for MEMS and IC fabrication.

原文English
主出版物標題Microelectromechanical Systems - Materials and Devices
頁面59-64
頁數6
出版狀態Published - 2008 六月 30
事件Microelectromechanical Systems - Materials and Devices - Boston, MA, United States
持續時間: 2007 十一月 262007 十一月 28

出版系列

名字Materials Research Society Symposium Proceedings
1052
ISSN(列印)0272-9172

Other

OtherMicroelectromechanical Systems - Materials and Devices
國家United States
城市Boston, MA
期間07-11-2607-11-28

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • 引用此

    Yan, H. Y., Ou, K. S., & Chen, K. S. (2008). Indentation characterization of fracture toughness and interfacial strength of PECVD nitrides after rapid thermal annealing. 於 Microelectromechanical Systems - Materials and Devices (頁 59-64). (Materials Research Society Symposium Proceedings; 卷 1052).