Influence of copper addition on adhesive strength of Sn-3Ag-1·5Sb solder joints

Keyphrases

• Solder Joint 100%
• Soldering 100%
• Adhesive Strength 100%
• Copper Addition 100%
• Liquidus Temperature 50%
• Growth Rate 25%
• Intermetallic Compound Layer 25%
• Degradation Rate 25%
• Cu Addition 25%
• Cu6Sn5 25%
• Cu Content 25%
• Interfacial Intermetallic Compound 25%
• Thermal Storage 25%
• Sn-matrix 25%
• Solidus Temperature 25%
• Sn Content 25%

Engineering

• Joints (Structural Components) 100%
• Adhesive Strength 100%
• Liquidus Temperature 50%
• Experimental Result 25%
• Intermetallics 25%
• Compound Layer 25%
• Thermal Energy Storage 25%
• Sn Content 25%
• Solidus Temperature 25%

Material Science

• Solder Joint 100%
• Intermetallics 33%