Influence of Cu addition on intermetallic compound formation and microstructure of Sn-3Ag-1.5Sb-xCu solder joints

H. T. Lee, W. Y. Huang, Y. F. Chen

研究成果: Article › 同行評審

3 引文 斯高帕斯（Scopus）

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Chemical Compounds

Engineering & Materials Science

Physics & Astronomy