Influence of Ga addition on microstructure, tensile properties and surface oxide film characteristics of microelectronic Sn-9Zn-xGa solders

Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Ping Hui Chen

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

The tensile properties of Sn-9Zn-xGa (x = 0, 0.4, 0.6, 0.8mass%) solders at room temperature and 120°C were first explored, and the specimens were then used to investigate the surface thin film characteristics. The results indicate that increasing the Ga content not only promoted needle-like Zn-rich phases to grow, but also caused the tensile strength and hardness to increase. In addition, the Ga was mostly solid solution in both β-Sn phases and bar-like Zn-rich phases. For high temperature tensile testing, the strength of the Sn-9Zn-xGa specimens was higher than the Sn-9Zn specimen. On the surface thin film, the effect of Ga solid solution not only promoted anti oxidation, but also suppressed the growth of the oxidative thin film of the Sn-9Zn solder under reflow or aging

原文English
頁(從 - 到)1496-1502
頁數7
期刊Materials Transactions
49
發行號7
DOIs
出版狀態Published - 2008 7月

All Science Journal Classification (ASJC) codes

  • 一般材料科學
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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