Influence of intermetallic compound on the stress distribution and fatigue life of halogen-free printed circuit board assembly

Tao Chih Chang, Hung Jen Chang, Chau Jie Zhan, Jing Yao Chang, Jia Wen Fan, Jung Hua Chou

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

A complete halogen-free test vehicle was achieved by assembling five ball grid array (BGA) components with daisy-chain on an 8-layer high density interconnection (HDI) printed circuit board with a low-halide Sn1.0Ag0.5Cu (SAC105) Pb-free solder pastes for reducing the formation of Ag3Sn. Afterward a board-level cyclic bending test was enforced on the as-reflowed assemblies according to the JESD22-B113 standard to evaluate the reliability of HF PCBA under a low-level load condition. The Weibull analyses showed that the characteristic lives of the assemblies were 99,098 and 130,290 cycles on Cu pad and electroless Ni pad, respectively, and the failure mode was the fracture of Cu trace within the micro-via induced by the crack of resin coated copper (RCC) layer. At the interfaces of solder joints, the intermetallic compound (IMC) formed on both Cu and electroless Ni was (Cu, Ni)6Sn5 with various Ni contents of 3.9 and 20.1 at%, respectively, and different thicknesses of 5.6 and 1.1 um. The simulation results pointed out that the factors of composition and thickness of IMC significantly influenced the stress distribution and characteristic life of the HF test vehicle. The stiff (Cu, Ni)6Sn5 constrained the deformation of solder joint interconnection, but increased the stress concentrated on soldering pad and RCC layer. Although the (Cu, Ni)6Sn5 on the electroless Ni was stiffer than that on the Cu pad, the thicker (Cu, Ni)6Sn5 instead increased the stress on the Cu pad due to size effect, and results in a lower characteristic life.

原文English
主出版物標題IMPACT Conference 2009 International 3D IC Conference - Proceedings
頁面220-223
頁數4
DOIs
出版狀態Published - 2009 十二月 1
事件IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
持續時間: 2009 十月 212009 十月 23

出版系列

名字IMPACT Conference 2009 International 3D IC Conference - Proceedings

Other

OtherIMPACT Conference 2009 International 3D IC Conference
國家/地區Taiwan
城市Taipei
期間09-10-2109-10-23

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程
  • 電子、光磁材料

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