Influence of intermetallic compound on the stress distribution and fatigue life of halogen-free printed circuit board assembly

Tao Chih Chang, Hung Jen Chang, Chau Jie Zhan, Jing Yao Chang, Jia Wen Fan, Jung Hua Chou

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

指紋

深入研究「Influence of intermetallic compound on the stress distribution and fatigue life of halogen-free printed circuit board assembly」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Chemical Compounds