Influence of intermetallic compounds on the adhesive strength of solder joints

Hwa Teng Lee; Ming Hung Chen

doi:10.1016/S0921-5093(01)01820-2

Influence of intermetallic compounds on the adhesive strength of solder joints

Hwa Teng Lee, Ming Hung Chen

機械工程學系

研究成果: Article › 同行評審

143 引文斯高帕斯（Scopus）

摘要

This study investigates the influence of intermetallic compound (IMC) growth on the adhesive strength of solder joints. 100Sn and 60Sn40Pb solders were used to solder electrolytic copper wires end to end. Soldered samples were then subjected to high temperature storage testing. The resulting interfacial IMCs in both solders were composed of Cu₆Sn₅ and Cu₃Sn. IMC in the 100Sn solder joint grew faster than in the 60Sn40Pb. The growth behavior of Cu₆Sn₅ and Cu₃Sn were subject to lead concentration. Results of tensile testing revealed an adhesive strength for 60Sn40Pb of 77.3 MPa, higher than the 50.0 MPa for 100Sn. 60Sn40Pb was found more sensitive to high temperature storage than 100Sn.

原文	English
頁（從 - 到）	24-34
頁數	11
期刊	Materials Science and Engineering: A
卷	333
發行號	1-2
DOIs	https://doi.org/10.1016/S0921-5093(01)01820-2
出版狀態	Published - 2002 8月

All Science Journal Classification (ASJC) codes

一般材料科學
凝聚態物理學
材料力學
機械工業

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10.1016/S0921-5093(01)01820-2

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title = "Influence of intermetallic compounds on the adhesive strength of solder joints",

abstract = "This study investigates the influence of intermetallic compound (IMC) growth on the adhesive strength of solder joints. 100Sn and 60Sn40Pb solders were used to solder electrolytic copper wires end to end. Soldered samples were then subjected to high temperature storage testing. The resulting interfacial IMCs in both solders were composed of Cu6Sn5 and Cu3Sn. IMC in the 100Sn solder joint grew faster than in the 60Sn40Pb. The growth behavior of Cu6Sn5 and Cu3Sn were subject to lead concentration. Results of tensile testing revealed an adhesive strength for 60Sn40Pb of 77.3 MPa, higher than the 50.0 MPa for 100Sn. 60Sn40Pb was found more sensitive to high temperature storage than 100Sn.",

author = "Lee, {Hwa Teng} and Chen, {Ming Hung}",

note = "Funding Information: The authors would like to thank the National Science Council of the Republic of China, Taiwan, for the financial support of this research under contract no. NSC 89-2216-E-006-021. ",

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T1 - Influence of intermetallic compounds on the adhesive strength of solder joints

AU - Lee, Hwa Teng

AU - Chen, Ming Hung

N1 - Funding Information: The authors would like to thank the National Science Council of the Republic of China, Taiwan, for the financial support of this research under contract no. NSC 89-2216-E-006-021.

PY - 2002/8

Y1 - 2002/8

N2 - This study investigates the influence of intermetallic compound (IMC) growth on the adhesive strength of solder joints. 100Sn and 60Sn40Pb solders were used to solder electrolytic copper wires end to end. Soldered samples were then subjected to high temperature storage testing. The resulting interfacial IMCs in both solders were composed of Cu6Sn5 and Cu3Sn. IMC in the 100Sn solder joint grew faster than in the 60Sn40Pb. The growth behavior of Cu6Sn5 and Cu3Sn were subject to lead concentration. Results of tensile testing revealed an adhesive strength for 60Sn40Pb of 77.3 MPa, higher than the 50.0 MPa for 100Sn. 60Sn40Pb was found more sensitive to high temperature storage than 100Sn.

AB - This study investigates the influence of intermetallic compound (IMC) growth on the adhesive strength of solder joints. 100Sn and 60Sn40Pb solders were used to solder electrolytic copper wires end to end. Soldered samples were then subjected to high temperature storage testing. The resulting interfacial IMCs in both solders were composed of Cu6Sn5 and Cu3Sn. IMC in the 100Sn solder joint grew faster than in the 60Sn40Pb. The growth behavior of Cu6Sn5 and Cu3Sn were subject to lead concentration. Results of tensile testing revealed an adhesive strength for 60Sn40Pb of 77.3 MPa, higher than the 50.0 MPa for 100Sn. 60Sn40Pb was found more sensitive to high temperature storage than 100Sn.

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Influence of intermetallic compounds on the adhesive strength of solder joints

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