Innovation and annealed effect of Sn-Al and Sn-Cu compositethin films on the electromagnetic interference shielding for the green materials

Fei Shuo Hung, Fei Yi Hung, Che Ming Chiang, Truan Sheng Lui

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Sn, Al and Cu not only possess electromagnetic interference shield efficiency, but also have the acceptable costs. In this study, sputtered Sn-Al thin films and Sn-Cu thin film were used to investigate the effect of the crystallization mechanism and film thickness on the electromagnetic interference (EMI) characteristics. In addition, the annealed microstructure, electrical conductivity and EMI of the Sn-xAl films and the Sn-xCu films were compared. The results show that Sn-Al film increased the electromagnetic interference (EMI) shielding after annealed. Sn-Cu films with higher Cu atomic concentration, the low frequency EMI shielding could not be improved. After annealing, the Sn-Cu thin film with lower Cu content possessed excellent EMI shielding at lower frequencies, but had an inverse tendency at higher frequencies.

原文English
主出版物標題Renewable and Sustainable Energy
頁面547-554
頁數8
DOIs
出版狀態Published - 2012
事件2011 International Conference on Energy, Environment and Sustainable Development, ICEESD 2011 - Shanghai, China
持續時間: 2011 10月 212011 10月 23

出版系列

名字Advanced Materials Research
347-353
ISSN(列印)1022-6680

Other

Other2011 International Conference on Energy, Environment and Sustainable Development, ICEESD 2011
國家/地區China
城市Shanghai
期間11-10-2111-10-23

All Science Journal Classification (ASJC) codes

  • 一般工程

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