Innovative orthosis for phalanx extension neurofacilitation (iOPEN) - Development of a 3D-printed hand orthosis for chronic stroke patient

Kai Chang, Jer Hao Chang, Meng Wen Huang, Li Ying Lee

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

Many chronic stroke patients have problems in finger active extension due to flexor spasticity and extensor weakness. Therefore, their affected hand cannot perform functional grasp and release. The purpose of this study is to develop a wearable device using 3D printing technology to assist stroke patients in hand function rehabilitation, especially grasp and release.

原文English
主出版物標題Proceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018
編輯Artde Donald Kin-Tak Lam, Stephen D. Prior, Teen-Hang Meen
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1175-1177
頁數3
ISBN(電子)9781538643426
DOIs
出版狀態Published - 2018 六月 22
事件4th IEEE International Conference on Applied System Innovation, ICASI 2018 - Chiba, Japan
持續時間: 2018 四月 132018 四月 17

出版系列

名字Proceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018

Other

Other4th IEEE International Conference on Applied System Innovation, ICASI 2018
國家Japan
城市Chiba
期間18-04-1318-04-17

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Energy Engineering and Power Technology
  • Control and Systems Engineering
  • Mechanical Engineering
  • Control and Optimization
  • Modelling and Simulation
  • Biomedical Engineering

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  • 引用此

    Chang, K., Chang, J. H., Huang, M. W., & Lee, L. Y. (2018). Innovative orthosis for phalanx extension neurofacilitation (iOPEN) - Development of a 3D-printed hand orthosis for chronic stroke patient. 於 A. D. K-T. Lam, S. D. Prior, & T-H. Meen (編輯), Proceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018 (頁 1175-1177). (Proceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASI.2018.8394495