Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects

Yeau Ren Jeng, Sang Mao Chiu

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric oxide films, the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need for the elaborate procedures and equipment required by more conventional wire bonding methods.

原文English
頁(從 - 到)279-283
頁數5
期刊Journal of Electronic Materials
35
發行號2
DOIs
出版狀態Published - 2006 2月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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