摘要
This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric oxide films, the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need for the elaborate procedures and equipment required by more conventional wire bonding methods.
原文 | English |
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頁(從 - 到) | 279-283 |
頁數 | 5 |
期刊 | Journal of Electronic Materials |
卷 | 35 |
發行號 | 2 |
DOIs | |
出版狀態 | Published - 2006 2月 |
All Science Journal Classification (ASJC) codes
- 電子、光磁材料
- 凝聚態物理學
- 電氣與電子工程
- 材料化學