Insight into Latchup Risk in 28nm Planar Bulk Technology for Quantum Computing Applications

Kateryna Serbulova, Zi En Qiu, Shih Hung Chen, Alexander Grill, Kuo Hsing Kao, Jo De Boeck, Guido Groeseneken

研究成果: Conference contribution

摘要

In this work, impact of cryogenic operation temperatures on latchup in 28nm planar bulk CMOS technology is discussed for quantum computing applications. Measurement and simulation results indicate that at low temperatures the sheet well resistances experiences 60% increase. Further simulations reveal that the vertical resistance increases leading to latchup risk. However, the current gain product of the parasitic bipolar transistors reduces, and holing voltage is increased with low temperatures which can compensate the latchup risk.

原文English
主出版物標題2024 IEEE International Reliability Physics Symposium, IRPS 2024 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9798350369762
DOIs
出版狀態Published - 2024
事件2024 IEEE International Reliability Physics Symposium, IRPS 2024 - Grapevine, United States
持續時間: 2024 4月 142024 4月 18

出版系列

名字IEEE International Reliability Physics Symposium Proceedings
ISSN(列印)1541-7026

Conference

Conference2024 IEEE International Reliability Physics Symposium, IRPS 2024
國家/地區United States
城市Grapevine
期間24-04-1424-04-18

All Science Journal Classification (ASJC) codes

  • 一般工程

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