TY - GEN
T1 - Intelligent data acquisition system for MEMS vibration monitoring applications
AU - Wu, Tsung Hsun
AU - Sue, Chung Yang
AU - Chen, Pei Yin
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/7/2
Y1 - 2018/7/2
N2 - The vibration generated by spindle defects, aging and abnormal operation is one of the main reasons causing the lack of precision to machine tools. To solve this problem, manufacturers began to adopt the industrial vibration sensor and data acquisition systems for preventive vibration monitoring, which expected to find abnormal vibration problems early before affecting the quality of processing in order to improve overall processing yield. However, the cost for the available sensors with data acquisition systems is quite expensive and some specifications cannot meet the requirements. Therefore, it is hard to implement or embed into machine tools due to the lower cost requirements and high-performance expectations in industrial applications. In order to develop a data acquisition system that satisfies the needs of machine tool manufacturers, the STMicroelectronics Coretex-M4 chip STM32F429 is adopted as the control core in this study to construct a "low-cost, high-efficiency, intelligent data acquisition system." Moreover, a vibration sensor is combined with the proposed data acquisition system to detect the vibration signal of the machine tool. The measured time-domain vibration data is transmitted to a local computer for fast Fourier transform (FFT) by using the virtual com port. Then, the timedomain and the results of the frequency-domain analysis of the vibration signals are displayed on the designed user interface (UI) at the same time for the user monitoring the current processing status of the machine tool clearly. From the experimental results, the proposed intelligent data acquisition system has both low-cost and high-efficiency features, which provides a high-value total solution for the manufacturers.
AB - The vibration generated by spindle defects, aging and abnormal operation is one of the main reasons causing the lack of precision to machine tools. To solve this problem, manufacturers began to adopt the industrial vibration sensor and data acquisition systems for preventive vibration monitoring, which expected to find abnormal vibration problems early before affecting the quality of processing in order to improve overall processing yield. However, the cost for the available sensors with data acquisition systems is quite expensive and some specifications cannot meet the requirements. Therefore, it is hard to implement or embed into machine tools due to the lower cost requirements and high-performance expectations in industrial applications. In order to develop a data acquisition system that satisfies the needs of machine tool manufacturers, the STMicroelectronics Coretex-M4 chip STM32F429 is adopted as the control core in this study to construct a "low-cost, high-efficiency, intelligent data acquisition system." Moreover, a vibration sensor is combined with the proposed data acquisition system to detect the vibration signal of the machine tool. The measured time-domain vibration data is transmitted to a local computer for fast Fourier transform (FFT) by using the virtual com port. Then, the timedomain and the results of the frequency-domain analysis of the vibration signals are displayed on the designed user interface (UI) at the same time for the user monitoring the current processing status of the machine tool clearly. From the experimental results, the proposed intelligent data acquisition system has both low-cost and high-efficiency features, which provides a high-value total solution for the manufacturers.
UR - http://www.scopus.com/inward/record.url?scp=85062442574&partnerID=8YFLogxK
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U2 - 10.1109/IMPACT.2018.8625743
DO - 10.1109/IMPACT.2018.8625743
M3 - Conference contribution
AN - SCOPUS:85062442574
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 252
EP - 255
BT - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
PB - IEEE Computer Society
T2 - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Y2 - 24 October 2018 through 26 October 2018
ER -