Interdiffusion behavior at the interfaces between deposits of Au nanoparticles and electronic substrates

Tzu Hsuan Kao, Jenn Ming Song, In Gann Chen, Teng Yuan Dong, Weng Sing Hwang

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

This study investigated the interfacial behavior between thiol-stabilized Au nanoparticle (NP) deposits and the commonly used electronic substrates, Cu, Ni and Ag. Instead of sintering or agglomerating, curing at 300°C resulted in either entire or partial melting of the deposited suspension because of the substantially low melting point of the Au NPs due to the nanosize effect; the melting point was measured to be 230-270°C. Thus a liquid-solid reaction might occur between the NP Au deposits and substrates during the thermal process. The elemental depth profiles examined by x-ray photoelectron spectroscopy (XPS) demonstrated that stoichiometric intermetallic phases, likely Cu3Au and NiAu3, existed respectively at the Au/Cu and Au/Ni interfaces, while a miscible solid solution of nonstoichiometric layer was found to have emerged at the Au/Ag interface. Also, the chemical shifts of binding energies inspected at the reaction layers reflected the alloying behavior at those interfaces.

原文English
文章編號435708
期刊Nanotechnology
18
發行號43
DOIs
出版狀態Published - 2007 10月 31

All Science Journal Classification (ASJC) codes

  • 生物工程
  • 化學 (全部)
  • 材料科學(全部)
  • 材料力學
  • 機械工業
  • 電氣與電子工程

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