摘要
This study investigated the interfacial behavior between thiol-stabilized Au nanoparticle (NP) deposits and the commonly used electronic substrates, Cu, Ni and Ag. Instead of sintering or agglomerating, curing at 300°C resulted in either entire or partial melting of the deposited suspension because of the substantially low melting point of the Au NPs due to the nanosize effect; the melting point was measured to be 230-270°C. Thus a liquid-solid reaction might occur between the NP Au deposits and substrates during the thermal process. The elemental depth profiles examined by x-ray photoelectron spectroscopy (XPS) demonstrated that stoichiometric intermetallic phases, likely Cu3Au and NiAu3, existed respectively at the Au/Cu and Au/Ni interfaces, while a miscible solid solution of nonstoichiometric layer was found to have emerged at the Au/Ag interface. Also, the chemical shifts of binding energies inspected at the reaction layers reflected the alloying behavior at those interfaces.
原文 | English |
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文章編號 | 435708 |
期刊 | Nanotechnology |
卷 | 18 |
發行號 | 43 |
DOIs | |
出版狀態 | Published - 2007 10月 31 |
All Science Journal Classification (ASJC) codes
- 生物工程
- 化學 (全部)
- 材料科學(全部)
- 材料力學
- 機械工業
- 電氣與電子工程