摘要
This study investigated the interfacial behavior between thiol-stabilized Au nanoparticle (NP) deposits and the commonly used electronic substrates, Cu, Ni and Ag. Instead of sintering or agglomerating, curing at 300°C resulted in either entire or partial melting of the deposited suspension because of the substantially low melting point of the Au NPs due to the nanosize effect; the melting point was measured to be 230-270°C. Thus a liquid-solid reaction might occur between the NP Au deposits and substrates during the thermal process. The elemental depth profiles examined by x-ray photoelectron spectroscopy (XPS) demonstrated that stoichiometric intermetallic phases, likely Cu3Au and NiAu3, existed respectively at the Au/Cu and Au/Ni interfaces, while a miscible solid solution of nonstoichiometric layer was found to have emerged at the Au/Ag interface. Also, the chemical shifts of binding energies inspected at the reaction layers reflected the alloying behavior at those interfaces.
| 原文 | English |
|---|---|
| 文章編號 | 435708 |
| 期刊 | Nanotechnology |
| 卷 | 18 |
| 發行號 | 43 |
| DOIs | |
| 出版狀態 | Published - 2007 十月 31 |
指紋
All Science Journal Classification (ASJC) codes
- Bioengineering
- Chemistry(all)
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering
引用此文
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Interdiffusion behavior at the interfaces between deposits of Au nanoparticles and electronic substrates. / Kao, Tzu Hsuan; Song, Jenn Ming; Chen, In Gann; Dong, Teng Yuan; Hwang, Weng Sing.
於: Nanotechnology, 卷 18, 編號 43, 435708, 31.10.2007.研究成果: Article
TY - JOUR
T1 - Interdiffusion behavior at the interfaces between deposits of Au nanoparticles and electronic substrates
AU - Kao, Tzu Hsuan
AU - Song, Jenn Ming
AU - Chen, In Gann
AU - Dong, Teng Yuan
AU - Hwang, Weng Sing
PY - 2007/10/31
Y1 - 2007/10/31
N2 - This study investigated the interfacial behavior between thiol-stabilized Au nanoparticle (NP) deposits and the commonly used electronic substrates, Cu, Ni and Ag. Instead of sintering or agglomerating, curing at 300°C resulted in either entire or partial melting of the deposited suspension because of the substantially low melting point of the Au NPs due to the nanosize effect; the melting point was measured to be 230-270°C. Thus a liquid-solid reaction might occur between the NP Au deposits and substrates during the thermal process. The elemental depth profiles examined by x-ray photoelectron spectroscopy (XPS) demonstrated that stoichiometric intermetallic phases, likely Cu3Au and NiAu3, existed respectively at the Au/Cu and Au/Ni interfaces, while a miscible solid solution of nonstoichiometric layer was found to have emerged at the Au/Ag interface. Also, the chemical shifts of binding energies inspected at the reaction layers reflected the alloying behavior at those interfaces.
AB - This study investigated the interfacial behavior between thiol-stabilized Au nanoparticle (NP) deposits and the commonly used electronic substrates, Cu, Ni and Ag. Instead of sintering or agglomerating, curing at 300°C resulted in either entire or partial melting of the deposited suspension because of the substantially low melting point of the Au NPs due to the nanosize effect; the melting point was measured to be 230-270°C. Thus a liquid-solid reaction might occur between the NP Au deposits and substrates during the thermal process. The elemental depth profiles examined by x-ray photoelectron spectroscopy (XPS) demonstrated that stoichiometric intermetallic phases, likely Cu3Au and NiAu3, existed respectively at the Au/Cu and Au/Ni interfaces, while a miscible solid solution of nonstoichiometric layer was found to have emerged at the Au/Ag interface. Also, the chemical shifts of binding energies inspected at the reaction layers reflected the alloying behavior at those interfaces.
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U2 - 10.1088/0957-4484/18/43/435708
DO - 10.1088/0957-4484/18/43/435708
M3 - Article
AN - SCOPUS:36148930673
VL - 18
JO - Nanotechnology
JF - Nanotechnology
SN - 0957-4484
IS - 43
M1 - 435708
ER -