Interdiffusion of the Electroless Ni-P Deposit with the Steel Substrate

Kwang Lung Lin, Po Jen Lai

研究成果: Article同行評審

20 引文 斯高帕斯(Scopus)


The diffusion between carbon steel substrate and the electroless Ni-P deposit were investigated with SEM-EDX and TEM for the microstructure of the diffusion layer and the diffusion kinetics. Phosphorus is excluded from the diffusion layer while nickel dissolves in iron to give the alpha-Fe phase. The diffusion layer grows parabolically with respect to time, and is strongly governed by temperature. The diffusivities were estimated with the Boltzmann-Matano method to show that the diffusion enroutes grain boundary at temperatures below 690°C while it enroutes lattice at higher temperatures. The activation energies for these two diffusion paths were estimated from the Arrhenius plot.

頁(從 - 到)1509-1513
期刊Journal of the Electrochemical Society
出版狀態Published - 1990 5月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 可再生能源、永續發展與環境
  • 表面、塗料和薄膜
  • 電化學
  • 材料化學


深入研究「Interdiffusion of the Electroless Ni-P Deposit with the Steel Substrate」主題。共同形成了獨特的指紋。