Interface behavior and electrical properties of Zn–Sn–Cu (CTZ) stacking layer films with thermal diffusion and electrically induced crystallization

Tai Hsiang Liu, Fei Yi Hung, Kuan Jen Chen

研究成果: Article同行評審

摘要

In this study, a Zn–Sn–Cu sandwich structure was heated and electrically crystallized. The morphology, phase structure, diffusion behavior, and interface electrical properties of the sandwich structure and the microstructure changes in Zn, Sn, and Cu driven by heat and electricity were investigated. The experimental results revealed that thermal effects caused marked diffusion of Cu atoms. Cu6Sn5 IMC was formed at the Cu–Sn interface, and Cu5Sn8 was formed at the Zn–Sn interface. The electron flow drove Sn atoms into Cu with directional diffusion and inhibited Cu6Sn5 formation. Moreover, the overall electrical properties, interlayer thickness, and microstructure differences varied with the diffusion behavior and interface composition caused by thermal and electrical effects.

原文English
頁(從 - 到)15547-15554
頁數8
期刊Journal of Materials Research and Technology
9
發行號6
DOIs
出版狀態Published - 2020 11月 1

All Science Journal Classification (ASJC) codes

  • 陶瓷和複合材料
  • 生物材料
  • 表面、塗料和薄膜
  • 金屬和合金

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