TY - JOUR
T1 - Interface behavior and electrical properties of Zn–Sn–Cu (CTZ) stacking layer films with thermal diffusion and electrically induced crystallization
AU - Liu, Tai Hsiang
AU - Hung, Fei Yi
AU - Chen, Kuan Jen
N1 - Publisher Copyright:
© 2020 The Authors
PY - 2020/11/1
Y1 - 2020/11/1
N2 - In this study, a Zn–Sn–Cu sandwich structure was heated and electrically crystallized. The morphology, phase structure, diffusion behavior, and interface electrical properties of the sandwich structure and the microstructure changes in Zn, Sn, and Cu driven by heat and electricity were investigated. The experimental results revealed that thermal effects caused marked diffusion of Cu atoms. Cu6Sn5 IMC was formed at the Cu–Sn interface, and Cu5Sn8 was formed at the Zn–Sn interface. The electron flow drove Sn atoms into Cu with directional diffusion and inhibited Cu6Sn5 formation. Moreover, the overall electrical properties, interlayer thickness, and microstructure differences varied with the diffusion behavior and interface composition caused by thermal and electrical effects.
AB - In this study, a Zn–Sn–Cu sandwich structure was heated and electrically crystallized. The morphology, phase structure, diffusion behavior, and interface electrical properties of the sandwich structure and the microstructure changes in Zn, Sn, and Cu driven by heat and electricity were investigated. The experimental results revealed that thermal effects caused marked diffusion of Cu atoms. Cu6Sn5 IMC was formed at the Cu–Sn interface, and Cu5Sn8 was formed at the Zn–Sn interface. The electron flow drove Sn atoms into Cu with directional diffusion and inhibited Cu6Sn5 formation. Moreover, the overall electrical properties, interlayer thickness, and microstructure differences varied with the diffusion behavior and interface composition caused by thermal and electrical effects.
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U2 - 10.1016/j.jmrt.2020.10.106
DO - 10.1016/j.jmrt.2020.10.106
M3 - Article
AN - SCOPUS:85119378704
SN - 2238-7854
VL - 9
SP - 15547
EP - 15554
JO - Journal of Materials Research and Technology
JF - Journal of Materials Research and Technology
IS - 6
ER -