Interfacial reactions in the Sn-20 at. % In/Cu and Sn-20 at. % In/Ni couples at 160 °C

Shih Kang Lin, Sinn Wen Chen

研究成果: Article同行評審

19 引文 斯高帕斯(Scopus)

摘要

Sn-In alloys are promising low-melting-point Pb-free solders. Cu and Ni are common substrates in the electronic products. This study examines the interfacial reactions in the Sn-20 at.% In(γ-InSn4) /Cu and Sn-20 at.% In/Ni couples at 160°C. Only the η-Cu6Sn5 phase layer is formed in the Sn-20 at.% In/Cu couple, and the layer grows thicker with longer reaction time. The reaction path is γ-InSn4/η- Cu6Sn5/Cu. A peculiar phenomenon with the bulging of the couple near the Ni substrate is found in the Sn-20 at.% In/Ni couple. A liquid phase is formed by interfacial reaction in the solid/solid Sn-20 at.% In/Ni couple at 160°C, and the reaction path is γ-InSn4/liquid/δ-Ni3Sn4 + liquid/(δ-Ni3Sn4)/Ni. Usually Ni has a slower reaction rate with solders; however, the consumption rates of Ni substrate are much higher than those of Cu substrate in this study when they are in contact with the Sn-20 at.% In alloy at 160°C due to the formation of the liquid phase in the Sn-20 at.% In/Ni couple.

原文English
頁(從 - 到)1712-1717
頁數6
期刊Journal of Materials Research
21
發行號7
DOIs
出版狀態Published - 2006 七月 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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