TY - JOUR
T1 - Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates
AU - Tseng, Tsan Hsien
AU - Yang, Chih Han
AU - Chiang, Jeng Yu
AU - Huang, Jyun Jhe
AU - Chen, Chih Hao
AU - Lin, Shih Kang
AU - Wang, Chang Meng
AU - Wu, Albert T.
N1 - Funding Information:
Financial support by MOST-104-2221-E-008-014-MY3 and SHENMAO Technology Inc. Prof. Jenq Gong Duh and Ms. Tsai from National Tsing Hua University in Taiwan are appreciated for their help with operating EPMA.
Funding Information:
Financial support by MOST - 104-2221-E-008-014-MY3 and SHENMAO Technology Inc .
Publisher Copyright:
© 2019 Elsevier B.V.
PY - 2019/6/24
Y1 - 2019/6/24
N2 - In this study, the interfacial reactions, microstructures, and intermetallic compounds (IMCs)of 68In–32Bi, 50In–50Bi, and 33In–67Bi (in weight percent)low melting alloys reacted with Cu substrates were investigated. CuIn2, Cu11In9, and Cu2In IMCs formed at the interface in different In–Bi/Cu systems and were characterized by grazing incidence X-ray diffraction (GIXRD)and electron probe X-ray microanalyzer (EPMA). The CuIn2 and Cu11In9 IMCs formed at the interface phase transfer to Cu11In9 when annealing temperature was greater than 70 °C. CALPHAD-type thermodynamic calculations were performed to illustrate the corresponding diffusion paths. Moreover, shear tests were conducted and indicated that 50In–50Bi solder joint provide the highest shear strength among the three alloys.
AB - In this study, the interfacial reactions, microstructures, and intermetallic compounds (IMCs)of 68In–32Bi, 50In–50Bi, and 33In–67Bi (in weight percent)low melting alloys reacted with Cu substrates were investigated. CuIn2, Cu11In9, and Cu2In IMCs formed at the interface in different In–Bi/Cu systems and were characterized by grazing incidence X-ray diffraction (GIXRD)and electron probe X-ray microanalyzer (EPMA). The CuIn2 and Cu11In9 IMCs formed at the interface phase transfer to Cu11In9 when annealing temperature was greater than 70 °C. CALPHAD-type thermodynamic calculations were performed to illustrate the corresponding diffusion paths. Moreover, shear tests were conducted and indicated that 50In–50Bi solder joint provide the highest shear strength among the three alloys.
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U2 - 10.1016/j.msea.2019.05.074
DO - 10.1016/j.msea.2019.05.074
M3 - Article
AN - SCOPUS:85066065651
VL - 759
SP - 506
EP - 513
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
SN - 0921-5093
ER -