Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

Tsan Hsien Tseng, Chih Han Yang, Jeng Yu Chiang, Jyun Jhe Huang, Chih Hao Chen, Shih Kang Lin, Chang Meng Wang, Albert T. Wu

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

In this study, the interfacial reactions, microstructures, and intermetallic compounds (IMCs)of 68In–32Bi, 50In–50Bi, and 33In–67Bi (in weight percent)low melting alloys reacted with Cu substrates were investigated. CuIn2, Cu11In9, and Cu2In IMCs formed at the interface in different In–Bi/Cu systems and were characterized by grazing incidence X-ray diffraction (GIXRD)and electron probe X-ray microanalyzer (EPMA). The CuIn2 and Cu11In9 IMCs formed at the interface phase transfer to Cu11In9 when annealing temperature was greater than 70 °C. CALPHAD-type thermodynamic calculations were performed to illustrate the corresponding diffusion paths. Moreover, shear tests were conducted and indicated that 50In–50Bi solder joint provide the highest shear strength among the three alloys.

原文English
頁(從 - 到)506-513
頁數8
期刊Materials Science and Engineering A
759
DOIs
出版狀態Published - 2019 6月 24

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

指紋

深入研究「Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates」主題。共同形成了獨特的指紋。

引用此