摘要
Interfacial reactions between a W thin film and a single-crystal (001) β-SiC substrate on rapid thermal annealing from 600 °C to 1100 °C for 60 s were investigated by backscattering spectrometry, X-ray diffraction, secondary ion mass spectrometry and cross-sectional transmission electron microscopy. Backscattering spectrometry shows that W reacts with SiC at 950 °C. The product phases identified by X-ray diffraction are W5Si3 and W2C. At 1100 °C no more unreacted W is detected. Current-voltage measurements show that ohmic contacts are already obtained on as-deposited W. Contact resistivity measured using the circular transmission line model is about 10-3 Ω cm2. Thermodynamic studies of the solid phase stability in the ternary WSiC system help us to understand the chemical stability of W thin film.
| 原文 | English |
|---|---|
| 頁(從 - 到) | 126-130 |
| 頁數 | 5 |
| 期刊 | Materials Science and Engineering B |
| 卷 | 29 |
| 發行號 | 1-3 |
| DOIs | |
| 出版狀態 | Published - 1995 1月 |
All Science Journal Classification (ASJC) codes
- 一般材料科學
- 凝聚態物理學
- 材料力學
- 機械工業