Interfacial stress intensity factors for edge-cracked bonded semicircles and strips under out-of-plane shear

Chih Hao Chen, Chien Chung Ke, Chein-Lee Wang

研究成果: Article

2 引文 斯高帕斯(Scopus)

摘要

Analytical expressions of the mode III interfacial stress intensity factor are derived for the edge-cracked problems in bonded semicircles and strips. The results are extracted from the solutions of the bonded finite sector by the conformal mapping method. Based on the method, the stress intensity factors for the problems with various crack lengths are achieved, and two corresponding cases are presented and discussed. The obtained solutions can serve as a reference for related crack problems.

原文English
頁(從 - 到)119-127
頁數9
期刊International Journal of Fracture
180
發行號1
DOIs
出版狀態Published - 2013 三月 1

All Science Journal Classification (ASJC) codes

  • Computational Mechanics
  • Modelling and Simulation
  • Mechanics of Materials

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