Interlaminar stresses around hole boundaries of composite laminates subjected to in-plane loading

Wen J. Yen, Chyanbin Hwu

研究成果: Article同行評審

6 引文 斯高帕斯(Scopus)

指紋

深入研究「Interlaminar stresses around hole boundaries of composite laminates subjected to in-plane loading」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Chemical Compounds