Investigated performance improvement of the micro-pressure sandblast-treated multi-crystalline Si wafer sliced using diamond wire sawing

Ting Chun Wang, Hsin Ying Lee, Ching Ting Lee, Yu Chin Cheng, Hung Wei Chen

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

In this work, the textured surface of the multi-crystalline silicon (mc-Si) wafers sliced by the diamond wire sawing (DWS) technique was formed using the X-Y axis micro-pressure sandblast treatment and the acidic texturing process. From the scanning electron microscopy (SEM) images, the X-Y axis micro-pressure sandblast treated DWS-sliced mc-Si wafers could effectively remove the saw marks caused by the fixed diamond abrasives. Furthermore, the textured surface of the acidic-textured DWS-sliced mc-Si wafers was also observed in the SEM images. Besides, using the X-Y axis micro-pressure sandblast treatment, the average reflectivity of the DWS-sliced mc-Si wafers was reduced from 28.94% to 22.28%. Consequently, the short-circuit current of 8.70 A and the power conversion efficiency of 17.92% for the DWS-sliced mc-Si solar cells with micro-pressure sandblast treatment were respectively better than 8.59 A and 17.35% in comparison with the DWS-sliced mc-Si solar cells without micro-pressure sandblast treatment.

原文English
頁(從 - 到)220-225
頁數6
期刊Solar Energy
161
DOIs
出版狀態Published - 2018 二月

All Science Journal Classification (ASJC) codes

  • 可再生能源、永續發展與環境
  • 材料科學(全部)

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