Investigation of mesoporous silica coated multi-wall carbon nanotubes on the mechanical and thermal properties of epoxy nanocomposites

Min Hua Chung, Ping Feng Yang, Chiu Wen Lee, Chih Ping Hung, Hong Ping Lin

研究成果: Conference contribution

摘要

In this study, mesoporous silica coated multi-wall carbon nanotubes (CNTs@MS) were synthesized using sodium silicate as the silica source and gelatin as the surface-activation agent. The effects of epoxy-based nanocomposites reinforced with CNTs@MS on the mechanical and thermal properties are characterized extensively using scanning electron microscopy (SEM), dynamic mechanical analysis (DMA), thermo-mechanical analysis (TMA) and thermal conductivity measurement, respectively. These results show that the mesoporous silica was integral coated on the CNTs. In addition, the storage modulus, glass transition temperature and thermal conductivity increased along with the amount of CNTs@MS (0.25, 0.5, 1.0 and 2.0 wt.%). The coefficient of thermal expansion decreased gradually, because the dipole-dipole interactions between the silica and epoxy polymer and confinement space of the mesoporous structure reduced the thermal mobility of the epoxy polymer inside the mesopore space.

原文English
主出版物標題2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
主出版物子標題Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面458-461
頁數4
ISBN(電子)9781479977277
DOIs
出版狀態Published - 2014 1月 1
事件9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan
持續時間: 2014 10月 222014 10月 24

出版系列

名字2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
國家/地區Taiwan
城市Taipei
期間14-10-2214-10-24

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程
  • 控制與系統工程

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