Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy

Chi Cheng Hung, Wen Hsi Lee, Ying Lang Wang, Din Yuen Chan, Gwo Jen Hwang

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

Polyethylene glycol (PEG) is an additive that is commonly used as a suppressor in the semiconductor copper (Cu)-electroplating process. In this study, electrochemical impedance spectroscopy (EIS) was used to analyze the electrochemical behavior of PEG in the Cu-electroplating process. Polarization analysis, cyclic-voltammetry stripping, and cell voltage versus plating time were examined to clarify the suppression behavior of PEG. The equivalent circuit simulated from the EIS data shows that PEG inhibited the Cu-electroplating rate by increasing the charge-transfer resistance as well as the resistance of the adsorption layer. The presence of a large inductance demonstrated the strong adsorption of cuprous-PEG-chloride complexes on the Cu surface during the Cu-electroplating process. Increasing the PEG concentration appears to increase the resistances of charge transfer, the adsorption layer, and the inductance of the electroplating system.

原文English
頁(從 - 到)1109-1114
頁數6
期刊Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
26
發行號5
DOIs
出版狀態Published - 2008

All Science Journal Classification (ASJC) codes

  • 凝聚態物理學
  • 表面和介面
  • 表面、塗料和薄膜

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