@inproceedings{e2d9a7ba6a1747ebb649babd21c35b3c,
title = "Investigation the plating and wetting ability of reactive sputtered Molybdenum-Tungsten multi-layers for advanced Cu metallization",
abstract = "Molybdenum-Tungsten (MoxW) alloy films were deposited on SiO2 substrates by reactive sputtering. Direct electroplating Cu on Molybdenum-Tungsten alloy films and annealing in N2 were carried out. In this study, the effect of electroplating time and annealing temperature on the structural, plating and wetting ability of Molybdenum-Tungsten alloy films was investigated. The films were characterized by X-ray photoelectron spectroscopy (XPS) and scanning electron microscope (SEM). The results show that Cu can be directly electroplated on Molybdenum-Tungsten alloy films with uniform nucleation. After annealing, de-wetting behavior of Molybdenum-Tungsten alloy films are shown to be better than Ta even up to 500°C.",
author = "Kuo, \{Tai Chen\} and Shih, \{Tzu Lang\} and Su, \{Yin Hsien\} and Lee, \{Wen Hsi\} and Liao, \{Wei Hsiang\}",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 16th IEEE International Conference on Nanotechnology - IEEE NANO 2016 ; Conference date: 22-08-2016 Through 25-08-2016",
year = "2016",
month = nov,
day = "21",
doi = "10.1109/NANO.2016.7751333",
language = "English",
series = "16th International Conference on Nanotechnology - IEEE NANO 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "703--705",
booktitle = "16th International Conference on Nanotechnology - IEEE NANO 2016",
address = "United States",
}