Investigation the plating and wetting ability of reactive sputtered Molybdenum-Tungsten multi-layers for advanced Cu metallization
- Tai Chen Kuo
- , Tzu Lang Shih
- , Yin Hsien Su
- , Wen Hsi Lee
- , Wei Hsiang Liao
研究成果: Conference contribution
1
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引文
斯高帕斯（Scopus）