Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAl high temperature lead free solders in air and Ar ambient

研究成果: Article同行評審

17 引文 斯高帕斯(Scopus)

摘要

Abstract Zn-25Sn based alloys possess great potential as candidates for high temperature lead-free solders. But it exhibits poor oxidation resistance due to the high Zinc content. This study selected Pr (0.01-0.08 wt%) and Al (0.01-0.25 wt%) as alloying elements to improve the wetting performance of Zn-25Sn based solder alloy. It was found that the addition of 0.01 wt% Pr increased the wetting force. However, dewetting was observed under air atmosphere for the Zn-25Sn, Pr-containing solder, and solder containing 0.01% Al. It was also be found that the dewetting of Pr-containing solder could be avoided under argon atmosphere as well as with higher Al addition.

原文English
文章編號34592
頁(從 - 到)852-858
頁數7
期刊Journal of Alloys and Compounds
646
DOIs
出版狀態Published - 2015 7月 6

All Science Journal Classification (ASJC) codes

  • 材料力學
  • 機械工業
  • 金屬和合金
  • 材料化學

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