Investigations on MgO-dielectric GaN/AlGaN/GaN MOS-HEMTs by using an ultrasonic spray pyrolysis deposition technique

Ching Sung Lee, Wei-Chou Hsu, Han Yin Liu, Ting Ting Wu, Wen Ching Sun, Sung Yen Wei, Sheng Min Yu

研究成果: Article

7 引文 (Scopus)

摘要

This work investigates GaN/Al0.24Ga0.76N/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs) grown on a Si substrate with MgO gate dielectric by using the non-vacuum ultrasonic spray pyrolysis deposition (USPD) technique. The oxide layer thickness is tuned to be 30 nm with the dielectric constant of 8.8. Electron spectroscopy for chemical analysis (ESCA), secondary ion mass spectrometry (SIMS), atomic force microscopy (AFM), transmission electron microscopy (TEM), C-V, low-frequency noise spectra, and pulsed I-V measurements are performed to characterize the interface and oxide quality for the MOS-gate structure. Improved device performances have been successfully achieved for the present MOS-HEMT (Schottky-gate HEMT) design, consisting of a maximum drain-source current density (I DS, max) of 681 (500) mA/mm at V GS = 4 (2) V, I DS at V GS = 0 V (I DSS0) of 329 (289) mA/mm, gate-voltage swing (GVS) of 2.2 (1.6) V, two-terminal gate-drain breakdown voltage (BV GD) of -123 (-104) V, turn-on voltage (V on) of 1.7 (0.8) V, three-terminal off-state drain-source breakdown voltage (BV DS) of 119 (96) V, and on/off current ratio (I on/I off) of 2.5 × 108 (1.2 × 103) at 300 K. Improved high-frequency and power performances are also achieved in the present MOS-HEMT design.

原文English
文章編號055012
期刊Semiconductor Science and Technology
31
發行號5
DOIs
出版狀態Published - 2016 三月 29

指紋

Spray pyrolysis
High electron mobility transistors
high electron mobility transistors
metal oxide semiconductors
pyrolysis
sprayers
ultrasonics
Ultrasonics
Metals
Electric breakdown
Oxides
electrical faults
Gates (transistor)
Electron spectroscopy
Gate dielectrics
Electric potential
Secondary ion mass spectrometry
oxides
electric potential
noise spectra

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

引用此文

Lee, Ching Sung ; Hsu, Wei-Chou ; Liu, Han Yin ; Wu, Ting Ting ; Sun, Wen Ching ; Wei, Sung Yen ; Yu, Sheng Min. / Investigations on MgO-dielectric GaN/AlGaN/GaN MOS-HEMTs by using an ultrasonic spray pyrolysis deposition technique. 於: Semiconductor Science and Technology. 2016 ; 卷 31, 編號 5.
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abstract = "This work investigates GaN/Al0.24Ga0.76N/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs) grown on a Si substrate with MgO gate dielectric by using the non-vacuum ultrasonic spray pyrolysis deposition (USPD) technique. The oxide layer thickness is tuned to be 30 nm with the dielectric constant of 8.8. Electron spectroscopy for chemical analysis (ESCA), secondary ion mass spectrometry (SIMS), atomic force microscopy (AFM), transmission electron microscopy (TEM), C-V, low-frequency noise spectra, and pulsed I-V measurements are performed to characterize the interface and oxide quality for the MOS-gate structure. Improved device performances have been successfully achieved for the present MOS-HEMT (Schottky-gate HEMT) design, consisting of a maximum drain-source current density (I DS, max) of 681 (500) mA/mm at V GS = 4 (2) V, I DS at V GS = 0 V (I DSS0) of 329 (289) mA/mm, gate-voltage swing (GVS) of 2.2 (1.6) V, two-terminal gate-drain breakdown voltage (BV GD) of -123 (-104) V, turn-on voltage (V on) of 1.7 (0.8) V, three-terminal off-state drain-source breakdown voltage (BV DS) of 119 (96) V, and on/off current ratio (I on/I off) of 2.5 × 108 (1.2 × 103) at 300 K. Improved high-frequency and power performances are also achieved in the present MOS-HEMT design.",
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Investigations on MgO-dielectric GaN/AlGaN/GaN MOS-HEMTs by using an ultrasonic spray pyrolysis deposition technique. / Lee, Ching Sung; Hsu, Wei-Chou; Liu, Han Yin; Wu, Ting Ting; Sun, Wen Ching; Wei, Sung Yen; Yu, Sheng Min.

於: Semiconductor Science and Technology, 卷 31, 編號 5, 055012, 29.03.2016.

研究成果: Article

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T1 - Investigations on MgO-dielectric GaN/AlGaN/GaN MOS-HEMTs by using an ultrasonic spray pyrolysis deposition technique

AU - Lee, Ching Sung

AU - Hsu, Wei-Chou

AU - Liu, Han Yin

AU - Wu, Ting Ting

AU - Sun, Wen Ching

AU - Wei, Sung Yen

AU - Yu, Sheng Min

PY - 2016/3/29

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N2 - This work investigates GaN/Al0.24Ga0.76N/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs) grown on a Si substrate with MgO gate dielectric by using the non-vacuum ultrasonic spray pyrolysis deposition (USPD) technique. The oxide layer thickness is tuned to be 30 nm with the dielectric constant of 8.8. Electron spectroscopy for chemical analysis (ESCA), secondary ion mass spectrometry (SIMS), atomic force microscopy (AFM), transmission electron microscopy (TEM), C-V, low-frequency noise spectra, and pulsed I-V measurements are performed to characterize the interface and oxide quality for the MOS-gate structure. Improved device performances have been successfully achieved for the present MOS-HEMT (Schottky-gate HEMT) design, consisting of a maximum drain-source current density (I DS, max) of 681 (500) mA/mm at V GS = 4 (2) V, I DS at V GS = 0 V (I DSS0) of 329 (289) mA/mm, gate-voltage swing (GVS) of 2.2 (1.6) V, two-terminal gate-drain breakdown voltage (BV GD) of -123 (-104) V, turn-on voltage (V on) of 1.7 (0.8) V, three-terminal off-state drain-source breakdown voltage (BV DS) of 119 (96) V, and on/off current ratio (I on/I off) of 2.5 × 108 (1.2 × 103) at 300 K. Improved high-frequency and power performances are also achieved in the present MOS-HEMT design.

AB - This work investigates GaN/Al0.24Ga0.76N/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs) grown on a Si substrate with MgO gate dielectric by using the non-vacuum ultrasonic spray pyrolysis deposition (USPD) technique. The oxide layer thickness is tuned to be 30 nm with the dielectric constant of 8.8. Electron spectroscopy for chemical analysis (ESCA), secondary ion mass spectrometry (SIMS), atomic force microscopy (AFM), transmission electron microscopy (TEM), C-V, low-frequency noise spectra, and pulsed I-V measurements are performed to characterize the interface and oxide quality for the MOS-gate structure. Improved device performances have been successfully achieved for the present MOS-HEMT (Schottky-gate HEMT) design, consisting of a maximum drain-source current density (I DS, max) of 681 (500) mA/mm at V GS = 4 (2) V, I DS at V GS = 0 V (I DSS0) of 329 (289) mA/mm, gate-voltage swing (GVS) of 2.2 (1.6) V, two-terminal gate-drain breakdown voltage (BV GD) of -123 (-104) V, turn-on voltage (V on) of 1.7 (0.8) V, three-terminal off-state drain-source breakdown voltage (BV DS) of 119 (96) V, and on/off current ratio (I on/I off) of 2.5 × 108 (1.2 × 103) at 300 K. Improved high-frequency and power performances are also achieved in the present MOS-HEMT design.

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