TY - GEN
T1 - Involvement of focal adhesion kinase in cell adhesion force on different substrate rigidity
AU - Su, Fong Chin
AU - Shao, Fang Yu
AU - Wu, Chia Ching
AU - Yeh, Ming Long
AU - Tang, Ming Jer
PY - 2009
Y1 - 2009
N2 - We hypothesize that FAK is the rigidity sensor in response to different rigidity of substrates. In present study, we plate MDCK epithelial cell on glass surface, 1kPa, and 30kPa polyacrylamide gels, respectively. The FAK expression for substrate rigidity sensing and adhesion force management was studied by cytodetachment device and fluorescent microscopy. Different expression levels of F AK by gene overexpression (FAK-WT) and knock-out (FRNK) were also used to probe the function of FAK in rigidity sensing. The results indicate that cell spreading area, adhesion force, and work increased with increasing substrate rigidity. Except for cell area and normalized adhesion force, all parameters were significantly different between FAK-WT and FRNK cells. FAK can enhance cell spreading and increase the normalized adhesion force on 30kPa and 1kPa gels. The effect of FAK is weaker on stiffer substrate than on softer matrix.
AB - We hypothesize that FAK is the rigidity sensor in response to different rigidity of substrates. In present study, we plate MDCK epithelial cell on glass surface, 1kPa, and 30kPa polyacrylamide gels, respectively. The FAK expression for substrate rigidity sensing and adhesion force management was studied by cytodetachment device and fluorescent microscopy. Different expression levels of F AK by gene overexpression (FAK-WT) and knock-out (FRNK) were also used to probe the function of FAK in rigidity sensing. The results indicate that cell spreading area, adhesion force, and work increased with increasing substrate rigidity. Except for cell area and normalized adhesion force, all parameters were significantly different between FAK-WT and FRNK cells. FAK can enhance cell spreading and increase the normalized adhesion force on 30kPa and 1kPa gels. The effect of FAK is weaker on stiffer substrate than on softer matrix.
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U2 - 10.1109/NEBC.2009.4967781
DO - 10.1109/NEBC.2009.4967781
M3 - Conference contribution
AN - SCOPUS:70349095597
SN - 9781424443628
T3 - Proceedings of the IEEE Annual Northeast Bioengineering Conference, NEBEC
BT - NEBEC 2009 - Proceedings of the IEEE 35th Annual Northeast Bioengineering Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE 35th Annual Northeast Bioengineering Conference, NEBEC 2009
Y2 - 3 April 2009 through 5 April 2009
ER -