Is 3D integration an opportunity or just a hype?

Jin Fu Li, Cheng Wen Wu

研究成果: Conference contribution

28 引文 斯高帕斯(Scopus)

摘要

Three-dimensional (3D) integration using through silicon via (TSV) is an emerging technology for integrated circuit designs. 3D integration technology provides numerous opportunities to designers looking for more cost-effective system chip solutions. In addition to stacking homogeneous memory dies, 3D integration technology supports heterogeneous integration of memories, logic, sensors, etc. It eases the interconnect performance limitation, provides higher functionality, results in small form factor, etc. On the other hand, there are challenges that should be overcome before volume production of TSV-based 3D ICs becomes possible, e.g., technological challenges, yield and test challenges, thermal and power challenges, infrastructure challenges, etc.

原文English
主出版物標題2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
頁面541-543
頁數3
DOIs
出版狀態Published - 2010 四月 28
事件2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010 - Taipei, Taiwan
持續時間: 2010 一月 182010 一月 21

出版系列

名字Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
國家/地區Taiwan
城市Taipei
期間10-01-1810-01-21

All Science Journal Classification (ASJC) codes

  • 電腦科學應用
  • 電腦繪圖與電腦輔助設計
  • 電氣與電子工程

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