Large-scale nanotwins in Cu films/Cu nanowires via stress engineering by a high-energy ion beam bombardment process: Growth and characterization

Tsung Cheng Chan, Yu Ze Chen, Yu Lun Chueh, Chien Neng Liao

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

Dense nanoscale twins were introduced into Cu films and nanowires through bombardment with high-energy Ar+ ions at low temperatures. Both the twin boundary density and indentation hardness of the ion-irradiated Cu films increased with decreases in the bombardment temperature. The improved mechanical strength in the ion-irradiated Cu films is attributed to twin boundary-dislocation and dislocation -dislocation interactions. The strengthened region is several hundreds of nanometers beneath the surface of the bombarded nanowires and thin strips. A mechanism based on irradiation-induced thermal spike cascades is proposed to explain the influence of the energy of the Ar+ ions and bombardment temperature on nanoscale twinning in crystalline Cu. This study provides a route to developing advanced interconnection technology for micro- and nanoelectronic devices.

原文English
頁(從 - 到)9805-9812
頁數8
期刊Journal of Materials Chemistry C
2
發行號46
DOIs
出版狀態Published - 2014 十二月 14

All Science Journal Classification (ASJC) codes

  • 化學 (全部)
  • 材料化學

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