Laser ablation of silicon using a Bessel-like beam generated by a subwavelength annular aperture structure

Yuh Yan Yu, Chin Kai Chang, Ming Wei Lai, Long Sun Huang, Chih Kung Lee

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

Using a femtosecond laser incident to an oxide-metal-oxide film engraved with a subwavelength annular aperture (SAA) structure, we generated a Bessel-like beam to ablate silicon. Experimental results show that the silicon can be ablated with a 0.05 J=cm2 input ablation threshold at 120 fs pulse duration. We obtained a surface hole possessing a diameter less than 1μm. Optical performance, including depth-of-focus and focal spot of the SAA structure, were simulated using finite-different time-domain calculations. We found that a far-field laser beam propagating through a SAA structure possesses a submicrometer focal spot and high focus intensity. Our method can be easily adopted for surface machining in microfabrication applications.

原文English
頁(從 - 到)6384-6390
頁數7
期刊Applied optics
50
發行號34
DOIs
出版狀態Published - 2011 12月 1

All Science Journal Classification (ASJC) codes

  • 原子與分子物理與光學
  • 工程(雜項)
  • 電氣與電子工程

指紋

深入研究「Laser ablation of silicon using a Bessel-like beam generated by a subwavelength annular aperture structure」主題。共同形成了獨特的指紋。

引用此