Life prediction of solder joints by damage and fracture mechanics

S. H. Ju, B. I. Sandor, M. E. Plesha

研究成果: Conference contribution


Much research has been done on Surface Mount Technology (SMT) using the Finite Element Method (FEM). Little of this, however, has employed fracture mechanics and/or continuum damage mechanics. In this study, we propose two finite element approaches incorporating fracture mechanics and continuum damage mechanics to predict time-dependent and temperature-dependent fatigue life of solder joints. For fracture mechanics, the J-integral fatigue formula, da/dN= C (ΔJ)m, is used to quantify fatigue crack growth and the fatigue life of J-leaded solder joints. For continuum damage mechanics, the anisotropic creep-fatigue damage formula with partially reversible damage effects is used to find the initial crack, crack growth path and fatigue life of solder joints. The concept of partially reversible damage is especially novel and, based on laboratory tests we have conducted, appears to be necessary for solder joints undergoing cyclic loading. Both of these methods are adequate to predict the fatigue life of solder joints. The advantage of the fracture mechanics approach is that little computer time is required. Its disadvantage is that assumptions must be made on the initial crack position and the crack growth path. The advantage of continuum damage mechanics is that the initial crack and its growth path are automatically evaluated, with the temporary disadvantage of requiring much computer time.

主出版物標題Structural Analysis in Microelectronics and Fiber Optics
編輯Luu T. Nguyen, Michael G. Pecht
發行者Publ by ASME
出版狀態Published - 1993 12月 1
事件Proceedings of the 1993 ASME Winter Annual Meeting - New Orleans, LA, USA
持續時間: 1993 11月 281993 12月 3


名字American Society of Mechanical Engineers, EEP


OtherProceedings of the 1993 ASME Winter Annual Meeting
城市New Orleans, LA, USA

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 機械工業


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