Low azeotropic solvent sealing of PMMA microfluidic devices

Che Hsin Lin, Lung Ming Fu, Chien Hsiung Tsai, Chien Hsiang Chao, Che Wei Lan

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

摘要

A new method for sealing PMMA-based microfluidic devices utilizing low azeotropic solvent, named DE-20, is developed. The bonding process can be achieved in 7 min at room temperature and can successfully bond microchannels as small as 40 μm in width without clogging. Results show the bonding strength and the increased roughness of the surface after the bonding process are 3.8 ±0.31 MPa (n = 8) and 10 nm respectively. The achieved bonding strength is 17-fold larger than the conventional thermal bonding. Furthermore, the proposed method can seal a 3-mm wide microfluidic channel without collapsing the channels since no heating process is required in the bonding process. The bonding performance is confirmed by using a zigzag type passive microfluidic mixer. Results present a high mixing efficiency can be achieved under a high driven pressure. More importantly, no leakage is observed under such high pressure.

原文English
主出版物標題TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
頁面944-947
頁數4
出版狀態Published - 2005
事件13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
持續時間: 2005 6月 52005 6月 9

出版系列

名字Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
1

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
國家/地區Korea, Republic of
城市Seoul
期間05-06-0505-06-09

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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