@article{a0f5dab314e84cd9a9dd65580dd2ffc4,
title = "Low conductivity decay of Sn-0.7Cu-0.2Zn photovoltaic ribbons for solar cell application",
abstract = "The present study applied Sn-0.7Cu-0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu-Zn solid-solution layer (Zn accumulation layer) existed at the Cu/solder interface. After a 72 h current stress, no detectable amounts of Cu6Sn5 were found. However, a small increase in Ag3Sn was found. Compared with a Sn-0.7Cu photovoltaic module, the increase of the intermetallic compounds thickness in the Sn-0.7Cu-0.2Zn photovoltaic module was much smaller. A retard in the growth of the intermetallic compounds caused the series resistance of the module to slightly increase by 9%. A Zn accumulation layer formed at the module interfaces by adding trace Zn to the Sn-0.7Cu solder, retarding the growth of the intermetallic compounds and thus enhancing the lifetime of the photovoltaic module.",
author = "Chen, {Kuan Jen} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Lin Hsu",
note = "Funding Information: Funding: This research was funded by Ministry of Science and Technology (MOST), grant number MOST 106-2221-E-006-064. Funding Information: This research was funded by Ministry of Science and Technology (MOST), grant number MOST 106-2221-E-006-064. The authors acknowledge Dr. Kuan-Jen Chen for assistance in technical services (SIMS), Ministry of Science and Technology (MOST) Instrument Center of National Cheng Kung University (NCKU), and MOST, Taiwan, for financially supporting this study under Grant No. MOST 106-2221-E-006-064. Funding Information: Acknowledgments: The authors acknowledge Dr. Kuan-Jen Chen for assistance in technical services (SIMS), Ministry of Science and Technology (MOST) Instrument Center of National Cheng Kung University (NCKU), and MOST, Taiwan, for financially supporting this study under Grant No. MOST 106-2221-E-006-064. Publisher Copyright: {\textcopyright} 2019 by the authors.",
year = "2019",
month = aug,
day = "1",
doi = "10.3390/mi10080550",
language = "English",
volume = "10",
journal = "Micromachines",
issn = "2072-666X",
publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",
number = "8",
}
