Low conductivity decay of Sn-0.7Cu-0.2Zn photovoltaic ribbons for solar cell application

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Lin Hsu

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

The present study applied Sn-0.7Cu-0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu-Zn solid-solution layer (Zn accumulation layer) existed at the Cu/solder interface. After a 72 h current stress, no detectable amounts of Cu6Sn5 were found. However, a small increase in Ag3Sn was found. Compared with a Sn-0.7Cu photovoltaic module, the increase of the intermetallic compounds thickness in the Sn-0.7Cu-0.2Zn photovoltaic module was much smaller. A retard in the growth of the intermetallic compounds caused the series resistance of the module to slightly increase by 9%. A Zn accumulation layer formed at the module interfaces by adding trace Zn to the Sn-0.7Cu solder, retarding the growth of the intermetallic compounds and thus enhancing the lifetime of the photovoltaic module.

原文English
文章編號550
期刊Micromachines
10
發行號8
DOIs
出版狀態Published - 2019 八月 1

All Science Journal Classification (ASJC) codes

  • 控制與系統工程
  • 機械工業
  • 電氣與電子工程

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