Low sintering temperature nano-silver pastes with high bonding strength by adding silver 2-ethylhexanoate

Steve Lien Chung Hsu, Yen Ting Chen, Meng Liang Chen, In Gann Chen

研究成果: Article同行評審

14 引文 斯高帕斯(Scopus)

摘要

A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250 C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10−7 Ω·m, and the shear strength was 57.48 MPa.

原文English
文章編號5941
期刊Materials
14
發行號20
DOIs
出版狀態Published - 2021 10月 1

All Science Journal Classification (ASJC) codes

  • 一般材料科學
  • 凝聚態物理學

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